3240 Epoxy Resin Board

3240 Epoxy Resin Board

3240 epoxy resin board is a high-quality glass fiber reinforced laminate widely used in electrical insulation and mechanical applications. It offers excellent electrical insulation, mechanical strength, and dimensional stability, making it ideal for industrial components and custom CNC machining.

Main features:

  • Excellent electrical insulation properties

  • High mechanical strength and stiffness

  • Good heat resistance and dimensional stability

  • Low water absorption

  • Suitable for CNC machining and custom parts

Category:

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Standard sizes: 1000*2000mm, 1220*2440mm; custom cutting and processing are available.
Color: Yellow
Standard thickness: 0.5-200mm
Free samples
Customization supported
1. Introduction to Epoxy Boards: Epoxy Boards
It is made by bonding fiberglass cloth and epoxy resin under high temperature and pressure. It exhibits excellent mechanical properties at moderate temperatures and stable electrical properties in high humidity environments. Suitable for high-insulation structural components in machinery, electrical appliances, and electronic products, it possesses excellent mechanical and dielectric properties, as well as good heat and moisture resistance. Heat resistance rating: F (155℃). Exposure to high temperatures (180℃) may cause deformation. Avoid heating with other metals to prevent deformation of the metal sheet.
3. Performance:
4. Characteristics of epoxy boards:
1. Multiple shapes. A variety of resin, curing agent and modifier systems can meet the shape requirements of almost all applications, from extremely low viscosity to high melting point solids.
2. Easy curing. Using different curing agents, epoxy systems can cure within a temperature range of 0–180°C. 3.
Strong adhesion. The inherent polar hydroxyl groups and ether bonds in the epoxy resin chain give it excellent adhesion to a variety of substrates. Low shrinkage and minimal internal stress during curing further enhance the adhesive strength. 4
Low shrinkage. The reaction between epoxy resin and curing agent is achieved through direct addition or ring-opening polymerization of epoxy groups within the resin molecule, without releasing water or other volatile byproducts. Compared to unsaturated polyester resins or phenolic resins, epoxy resins exhibit extremely low shrinkage (less than 2%) during curing.
5. Processing Examples:

bcApplications of epoxy resin boards:
Suitable for the machinery, electrical, electronics, and home appliance industries. It can also be used to process insulating elements into various insulating accessories and equipment insulating structural parts.

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Contact us for insulation materials, engineering plastics, or drawing-based custom machining services.
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Get in Touch with Us

Contact us for insulation materials, engineering plastics, or drawing-based custom machining services.
Our team is ready to provide technical advice and fast quotations to support your project.

Get in Touch with Us

Contact us for insulation materials, engineering plastics, or drawing-based custom machining services.
Our team is ready to provide technical advice and fast quotations to support your project.