Standard Sizes: 1000*2000mm, 1220*2440mm, custom cutting and processing available
Color: Yellow
Standard Thickness: 0.5-200mm
Free Samples
Customization Supported
1: Epoxy Board Introduction:
Manufactured by bonding fiberglass cloth with epoxy resin under heat and pressure. Exhibits high mechanical properties at moderate temperatures and stable electrical performance in high humidity. Suitable for high-insulation structural components in machinery, electrical appliances, and electronics, offering superior mechanical and dielectric properties along with good heat and moisture resistance. Heat resistance rating: Class F (155°C). May deform when exposed to high temperatures (180°C). Avoid heating alongside other metals to prevent deformation of metal sheets.
3. Properties:
4. Epoxy Board Characteristics:
1. Versatile forms. Various resin, curing agent, and modifier systems can accommodate nearly all application requirements for form, ranging from extremely low viscosity to high-melting-point solids.
2. Convenient Curing. With various curing agents, epoxy systems can cure within a temperature range of 0–180°C.
3. Strong Adhesion. The inherent polar hydroxyl groups and ether bonds in epoxy resin chains provide exceptional adhesion to diverse substrates. Low shrinkage during curing and minimal internal stress further enhance bonding strength.
4. Low shrinkage. The reaction between epoxy resin and curing agents occurs via direct addition or ring-opening polymerization of epoxy groups within the resin molecules, without releasing water or other volatile byproducts. Compared to unsaturated polyester resins or phenolic resins, epoxy resins exhibit minimal shrinkage (less than 2%) during curing.
5. Processing Examples:

Epoxy Board Applications:
Suitable for mechanical, electrical, electronic, and appliance industries. Also used for processing insulating components into various insulating fittings and structural parts for equipment insulation.